XPS & AES Makers xxx xxx

AES Makers (A-Z order) AES Systems
	JEOL JAMP-9500F AES made in Japan		Omicron Nanotechnology NanoSAM made in Germany		Thermo-Fisher 350F AES made in England		Ulvac-PHI 700 Auger Nanoprobe made in USA
JAMP-9500F The JAMP-9500F Field Emission Auger Microprobe offers the highest spatial resolution available in a microprobe: (min. probe diameter of 3nm SEI; 8nm for Auger analysis). Employing a low-aberration condenser lens (in which an electrostatic field and a magnetic field are superposed), combined with a patented "in-lens" Schottky field emission gun, the JAMP-9500F obtains very small spot sizes with beam currents up to 500nA. The electron spectrometer is an electrostatic hemispherical analyzer (HSA) with a multi-channel detector, and was optimally designed for Auger analysis. It provides extreme energy resolution without sacrificing sensitivity. With the JAMP-9500F, high resolution SEM imaging is possible as well as Auger image analysis and line profile analysis. Also, depth profile analysis can be performed during ion etching. The JAMP-9500F features a high performance ion gun for high speed sputtering and low energy charge neutralization. User-friendly and easily operated, the JAMP-9500F also offers the flexibility of optional analysis functions such as EDS, SIMS and XPS. Features 3nm SEI resolution 8nm probe diameter for Auger analysis Variable energy resolution from 0.05% to 0.6% Chemical state analysis in several 10nm areas Neutralizing gun allows Auger analysis of insulating materials Large specimen stage - samples up to 95mm in diameter		NanoSAM The NanoSAM Lab is the ultimate tool for the analysis of small structures. Driven by the unique performance of the UHV Gemini electron column it guarantees unrivalled resolution below 5 nm in Scanning Auger Microscopy (SAM) and better than 3 nm in SEM. In contrast to other Auger tools the extremely good resolution is not only available at standard 20kV beam energy, but even at 5 keV the SAM resolution remains below 10 nm. This allows operation in a parameter range where the Auger cross sections are high, and well documented for quantitative analysis. The NanoSAM Lab is tailored for the fast and efficient acquisition of data on routine samples, while maintaining the flexibility to operate in untypical parameter ranges on challenging materials. Furthermore, the NanoSAM Lab may be extended with additional techniques for a complementary analysis of the key sample characteristics, for example the crystal structure (EBSD), or the magnetic domain structure (SEMPA)		350F MICROLAB 350 is a high-performance, scanning Auger Electron Spectrometer (AES) with High Sensitivity and High Energy Resolution. SEM resolution <7 nm and Scanning Auger Mapping (SAM) resolution <12 nm. Product detail: High-performance scanning Auger electron spectrometer (AES) Secondary Electron Mapping (SEM) at <7 nm Resolution Scanning Auger Mapping (SAM) at <12 nm Resolution High Sensitivity Spherical Sector Analyser Allows High Energy Resolution for: Chemical state determination Reflected Electron Energy Loss Spectroscopy (REELS) Measurement of dopants in silicon Multitechnique Capability Including: X-ray photoelectron spectroscopy (XPS) Energy dispersive X-ray spectroscopy (EDX) Backscattered electron detection FIB Preparation Facilities Including: Fracture Stage Heating/Cooling Stage Evaporation Stage		PHI 700 Nanoprobe The PHI 700 Scanning Auger Nanoprobe is a state-of-the-art, high performance Auger Electron Spectroscopy (AES) surface analysis system that provides elemental and chemical state information of sample surfaces, submicron features, thin films and interfaces. The 700’s Schottky field emission optics provide Auger spatial resolution of less than 8 nm. The result is rapid, high resolution secondary electron and Auger imaging of submicron features. The coaxial geometry of the 700’s electron column and the Cylindrical Mirror Analyzer (CMA) enables rapid, accurate Auger analysis of all samples, including those with rough surfaces or complex geometries, as analytical shadowing is eliminated. High performance Auger spectral analysis, SEM/Auger imaging, and depth profiles combine to provide complete characterization of complex samples such as: Semiconductor devices: surface defects or particles, imbedded defects, contamination, thin films and failure analysis Metals: coatings, composites, grain boundary analysis (including in situ fracture), corrosion and other failures The 700 features a five-axis, fully-motorized specimen stage controlled with PHI’s new SmartSoft user interface, which is now available with a Die Navigation module. The specimen stage and software combine to provide flexibility in sample handling and the ability to automatically analyze multiple features or samples.